The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2009
Filed:
Dec. 06, 2005
Yutaka Kaneda, Kanuma, JP;
Keiichi Naito, Kanuma, JP;
Soichiro Kishimoto, Kanuma, JP;
Toshihiro Shinohara, Kanuma, JP;
Yutaka Kaneda, Kanuma, JP;
Keiichi Naito, Kanuma, JP;
Soichiro Kishimoto, Kanuma, JP;
Toshihiro Shinohara, Kanuma, JP;
Sony Corporation, Tokyo, JP;
Sony Chemical & Information Device Corporation, Tokyo, JP;
Abstract
An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching maskis formed on the bump formation sideof a metal foilhaving a thickness (t+t) equal to the sum of the thickness tof a wiring circuitand the height tof the bumpsto be formed on a wiring circuit, the bumpsare formed by half-etching the metal foilfrom the bump formation etching maskside down to a depth corresponding to a predetermined bump height t, and a metal thin film layercomposed of a different metal from the metal foilis formed on the bump formation side of the metal foil, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.