The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2009

Filed:

Dec. 14, 2006
Applicants:

Norman Bruce Desrosiers, Oxford, NC (US);

Michael Dudley French, Jr., Raleigh, NC (US);

Dean Frederick Herring, Yongsville, NC (US);

Daniel Paul Kelaher, Holly Springs, NC (US);

Paul Andrew Wormsbecher, Apex, NC (US);

Inventors:

Norman Bruce Desrosiers, Oxford, NC (US);

Michael Dudley French, Jr., Raleigh, NC (US);

Dean Frederick Herring, Yongsville, NC (US);

Daniel Paul Kelaher, Holly Springs, NC (US);

Paul Andrew Wormsbecher, Apex, NC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/34 (2006.01); F28F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Apparatus and method for securing a heat sink to a heat-generating device on a circuit board. The apparatus clamps onto the heating-generating device and the circuit board in a manner that avoids bending of the circuit board. The apparatus includes a retention module having a plurality of retention features that extend through openings in the circuit board disposed about the perimeter of the heat-generating device, such as a processor. The apparatus also includes a heat sink having a heat sink base for contacting the heat-generating device in order to dissipate heat produced by the device. The heat sink is selectively securable to the retention features of the retention module using levers, such as a wire module, having a spring clip to engage the retention features and clamp the heat sink and retention module together.


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