The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2009
Filed:
Jul. 06, 2006
Chang-yong Park, Cheonan-si, KR;
Hyun-jong OH, Cheonan-si, KR;
Yong-hyun Kim, Suwon-si, KR;
Dong-woo Shin, Cheonan-si, KR;
Kyung-du Kim, Daejeon, KR;
Dong-chun Lee, Cheonan-si, KR;
Kwang-ho Chun, Asan-si, KR;
Chang-Yong Park, Cheonan-si, KR;
Hyun-Jong Oh, Cheonan-si, KR;
Yong-Hyun Kim, Suwon-si, KR;
Dong-Woo Shin, Cheonan-si, KR;
Kyung-Du Kim, Daejeon, KR;
Dong-Chun Lee, Cheonan-si, KR;
Kwang-Ho Chun, Asan-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A heat spreader includes a heat sinking plate and a pressure clip. The heat sinking plate radiates the heat away from a heat source. The pressure clip fixes the heat sinking plate to the heat source. The pressure clip includes a spine (pressing part), one or more ribs and hook parts. The spine is arranged on the heat sinking plate. The one or more ribs extend from the spine and contact the heat source. The hook parts extend from the spine and are supported by the heat source. The pressure clip further includes mounting parts that couple the spine to the hook parts. A bending space is formed between the spine and the heat sinking plate. The heat spreader may be attached to a printed circuit board (PCB) with, e.g., a one-touch method, so that assembling processes of the memory module may be automated.