The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2009
Filed:
Jun. 08, 2005
Hans Krueger, Munich, DE;
Karl Nicolaus, Munich, DE;
Juergen Portmann, Munich, DE;
Peter Selmeier, Maitenbeth, DE;
Hans Krueger, Munich, DE;
Karl Nicolaus, Munich, DE;
Juergen Portmann, Munich, DE;
Peter Selmeier, Maitenbeth, DE;
EPCOS AG, Munich, DE;
Abstract
A component includes a carrier substrate having a coefficient of thermal expansion αand a chip mounted on the carrier substrate by a plurality of bumps. The chip has a first coefficient of thermal expansion αin a first direction xand a first expansion difference, Δαequal to the absolute value of α−α. The chip also has a second coefficient of thermal expansion αin a second direction xand a second expansion difference Δαis equal to the absolute value of α−α,. The bumps are arranged such that a first distance, Δx, corresponding to a normal projection of a line between centers of terminally situated bumps in the first direction onto an axis running parallel to direction xis less than a second distance corresponding to a normal projection of a line between centers of terminally situated bumps in the second direction onto an axis parallel to direction x.