The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7517808 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 14, 2009

Filed:

Jul. 28, 2003
Applicants:

Gregory Becker, Sanford, MI (US);

Geoffrey Gardner, Sanford, MI (US);

Brian Harkness, Midland, MI (US);

Inventors:

Gregory Becker, Sanford, MI (US);

Geoffrey Gardner, Sanford, MI (US);

Brian Harkness, Midland, MI (US);

Assignee:

Dow Corning Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/469 (2006.01); H01B 13/00 (2006.01); C03C 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for reworking semiconductor materials includes: (i) applying a silicone composition to a surface of a substrate to form a film, (ii) exposing a portion of the film to radiation to produce a partially exposed film having non-exposed regions covering a portion of the surface and exposed regions covering the remainder of the surface; (iii) heating the partially exposed film for an amount of time such that the exposed regions are substantially insoluble in a developing solvent and the non-exposed regions are soluble in the developing solvent; (iv) removing the non-exposed regions of the heated film with the developing solvent to form a patterned film; (v) heating the patterned film for an amount of time sufficient to form a cured silicone layer; and (vi) removing all or a portion of the cured silicone layer by exposure to an anhydrous etching solution including an organic solvent and abase.


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