The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2009
Filed:
Jul. 20, 2005
Applicants:
Harry Hedler, Germering, DE;
Anton Legen, Munich, DE;
Inventors:
Harry Hedler, Germering, DE;
Anton Legen, Munich, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention provides a method for connection of an integrated circuit (), in particular of a chip, a wafer or a hybrid, to a substrate (), which has the following steps: provision of an elastic intermediate layer () on the integrated circuit () and/or the substrate (); structuring of the elastic layer () in raised areas () and recessed areas (); and connection of the substrate () and of the integrated circuit () via the structured elastic intermediate layer (). The invention likewise provides a corresponding circuit arrangement.