The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7517207 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 14, 2009

Filed:

Jun. 07, 2006
Applicant:

Ming-chiang Tsai, Tu-Cheng, TW;

Inventor:

Ming-Chiang Tsai, Tu-Cheng, TW;

Assignee:

Hon Hai Precision Industry Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

An injection molding device () includes an upper mold (), a core insert (), and a lower mold (). The upper mold defines a main flow passage () and a cylindrical receiving cavity () communicating with the main flow passage. The core insert is rotatably received in the cylindrical receiving cavity and defines a secondary flow passage () communicating with the main flow passage and at least one upper half molding cavity (). The lower mold defines at least one lower half molding cavity () cooperating with the upper half molding cavity to form a full molding cavity.


Find Patent Forward Citations

Tsai, Ming-Chiang. (2009). Injection molding device (U.S. Patent No. 7517207). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7517207

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…