The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2009
Filed:
Mar. 31, 2006
Akihiro Hasegawa, Kawasaki, JP;
Akihiro Hasegawa, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
After an interlayer insulation film () and a CMP stopper film are formed, wiring trenches are formed. Next, after a barrier metal film () and a Cu film () are buried in the wiring trenches, the Cu film () and the barrier metal film () are planarized by CMP or the like until the CMP stopper film is exposed, whereby lower wirings () are formed. Next, the CMP stopper film is removed by dry etching, so that surfaces of the lower wirings () relatively protrude from their surrounding area. Subsequently, an etching stopper film () is formed on the entire surface. Thereafter, via plugs () are formed, and upper wirings () are further formed in the same manner as the lower wirings ().