The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2009
Filed:
Apr. 05, 2007
Seiki Hiramatsu, Tokyo, JP;
Kei Yamamoto, Tokyo, JP;
Atsuko Fujino, Tokyo, JP;
Hiromi Ito, Tokyo, JP;
Seiki Hiramatsu, Tokyo, JP;
Kei Yamamoto, Tokyo, JP;
Atsuko Fujino, Tokyo, JP;
Hiromi Ito, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
An objective is to provide a reliability-improved semiconductor device in which heat radiation characteristics are superior, and warpage of the semiconductor device occurring due to heat generation of a semiconductor chip or to varying of the usage environment is also suppressed. The semiconductor device is provided that includes a thermal-conductive sheetformed on a base board, including thermal-conductive resin, a heat sinkprovided on the base boardthrough the thermal-conductive sheet, a semiconductor chipmounted on the heat sink, and a ceramic-embedded regionselectively provided in a region of the thermal-conductive sheetunder the semiconductor chip, including a ceramic component. In this semiconductor device, superior thermal conductivity can be ensured, and warpage and peeling in the semiconductor device occurring due to heat generation of the semiconductor chip or to varying of the usage environment can also be reduced.