The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7514718 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 07, 2009

Filed:

Apr. 18, 2006
Applicants:

Kyu-ho Shin, Seoul, KR;

Su-ho Shin, Seongnam-si, KR;

Soon-cheol Kweon, Seoul, KR;

Chang-youl Moon, Suwon-si, KR;

Jin-seung Choi, Suwon-si, KR;

Inventors:

Kyu-ho Shin, Seoul, KR;

Su-ho Shin, Seongnam-si, KR;

Soon-cheol Kweon, Seoul, KR;

Chang-youl Moon, Suwon-si, KR;

Jin-seung Choi, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
Abstract

An LED package includes a substrate, an LED, and a cap. The substrate includes a first conductor unit, a second conductor unit, and a non-conductor unit which electrically insulates the first and second conductor unit. The LED is bonded to the first conductor unit. The cap is mounted on the substrate over the LED and comprises a conductive wire which connects the LED to the second conductor unit.


Find Patent Forward Citations

Shin, Kyu-ho. (2009). Led package, manufacturing method thereof, and led array module using the same (U.S. Patent No. 7514718). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7514718

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