The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2009
Filed:
Nov. 29, 2005
Applicant:
Yorihiko Sasaki, Miyagi-ken, JP;
Inventor:
Yorihiko Sasaki, Miyagi-ken, JP;
Assignee:
Alps Electric Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A circuit component module includes a heat-releasing plate, a resin film stacked on a surface of the heat-releasing plate, an electronic component embedded in the first resin film and partially in contact with the heat-releasing plate, and a wiring pattern embedded in the surface of the first resin film opposite the heat-releasing plate. The wiring pattern forms a circuit in combination with the electronic component.
Sasaki, Yorihiko. (2009). Circuit component module, electronic circuit device, and method for manufacturing the circuit component module (U.S. Patent No. 7514636). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7514636
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile