The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2009

Filed:

Jul. 13, 2005
Applicants:

Gerhard Roth, Rheinstetten, DE;

Helmut Krauth, Hanau, DE;

Inventors:

Gerhard Roth, Rheinstetten, DE;

Helmut Krauth, Hanau, DE;

Assignee:

Bruker EAS GmbH, Hanau, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 12/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A superconductor element comprising NbSn, in particular, multi-filament wire, which contains at least one superconducting filament () which is obtained after drawing through solid diffusion reaction from an initial filament structure which comprises a longitudinal hollow tube () of niobium (Nb) or an Nb alloy, in particular, NbTa or NbTi, with an inner surface () and an outer surface (), wherein the tube () is embedded into a thermally and electrically highly conducting metal matrix (), in particular, of copper (Cu), wherein the tube () is filled with a material () which contains tin (Sn) is characterized in that, for mechanical reinforcement of the conductor element and as a diffusion barrier during solid diffusion reaction, the outer surface () of the tube () is directly and completely surrounded by a sleeve () made from a metallic material which has, at room temperature, a thermal expansion coefficient α<17*10K, preferably α<8*10K, an elastic limit R>300 MPa and a cross-sectional reduction A>20%, wherein the metallic material is selected to be chemically inert to diffusing tin (Sn) up to a reaction temperature T of the solid diffusion reaction.


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