The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2009

Filed:

Feb. 28, 2005
Applicant:

Nobuo Ozawa, Minato-ku, JP;

Inventor:

Nobuo Ozawa, Minato-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method that forms individual semiconductor devices from a semiconductor substrate including a first face having a first region in which micro-mechanical elements are formed and a second region which surrounds the first region and in which a scribe line is formed, and a second face having a third region which is opposed to the first face and corresponds to the first region in which the micro-mechanical elements are formed and a fourth region which surrounds the third region and corresponds to the second region. The method includes thinning the fourth region of the second face which corresponds to the scribe line formed in the second region of the first face, and cutting the semiconductor substrate along the scribe line formed in the second region of the first face.


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