The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2009
Filed:
Oct. 21, 2003
Tetsuya Yoshikawa, Takasago, JP;
Yoichi Inoue, Takasago, JP;
Katsumi Watanabe, Takasago, JP;
Kaoru Masuda, Kobe, JP;
Katsuyuki Iijima, Kobe, JP;
Tomomi Iwata, Kyoto, JP;
Yusuke Muraoka, Kyoto, JP;
Kimitsugu Saito, Kyoto, JP;
Ikuo Mizobata, Kyoto, JP;
Tetsuya Yoshikawa, Takasago, JP;
Yoichi Inoue, Takasago, JP;
Katsumi Watanabe, Takasago, JP;
Kaoru Masuda, Kobe, JP;
Katsuyuki Iijima, Kobe, JP;
Tomomi Iwata, Kyoto, JP;
Yusuke Muraoka, Kyoto, JP;
Kimitsugu Saito, Kyoto, JP;
Ikuo Mizobata, Kyoto, JP;
Kabushiki Kaisha Kobe Seiko Sho, Kobe-shi, JP;
Dainippon Screen Mfg. Co., Ltd., Kyoto-shi, JP;
Abstract
Disclosed is a high pressure processing method for subjecting a processing object to a high pressure processing using a high pressure fluid. In this method, the high pressure fluid is brought into collision with the surface of the processing object placed in a high pressure processing chamber, and then distributed along the surface of the processing object in an outward direction beyond the processing object.