Semiconductor device and method for fabricating the same

Abstract

In a semiconductor device having a WCSP type construction package, to increase inductance without increasing further an area conventionally occupied by a coil. A pseudo-post partcomprising a magnetic body is extended in a direction perpendicular to a main surfaceof a semiconductor chipon a second insulating layerof a WCSPA first conductive partand a second conductive partconstructed as square frames are respectively provided so as to surround the pseudo-post part, on respective top surfaces of a second insulation layer and a third insulating layerwhich are separated parallel to each other, in an extension direction of the pseudo-post part. A coilbeing a substantially spiral shape conductive path is formed from, the first conductive part, the second conductive part, and a connection partwhich electrically connects the one ends of the first and second conductive parts.