The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
Oct. 02, 2007
Applicants:
Mark A. Alexander, San Francisco, CA (US);
Paul Ying-fung Wu, Saratoga, CA (US);
Inventors:
Mark A. Alexander, San Francisco, CA (US);
Paul Ying-Fung Wu, Saratoga, CA (US);
Assignee:
Xilinx, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
Abstract
A packaged integrated circuit ('IC') includes a substrate, an IC die, and a molded plastic lid. A test point standoff is electrically connected to the IC die and extends away from the surface of the package substrate through the molded plastic lid toward the top surface of the molded plastic lid. The top of the test point standoff is below the top surface of the molded plastic lid.