The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
Mar. 20, 2006
Shohei Hata, Yokohama, JP;
Naoki Matsushima, Yokohama, JP;
Takeru Fujinaga, Hitachinaka, JP;
Hitachi Kyowa Engineering Co., Ltd., Ibaraki, JP;
Abstract
The present invention is characterized by a structure having a substrateand metallization layersformed on the substrateon which a Sn solder filmand an Ag filmare formed. The Ag filmis a metal free from oxidization at room temperature in the atmosphere. In a wet process, since only an exposed side of the Sn solder filmis oxidized by the cell reaction of Ag and Sn, an upper surface of the Ag filmon the solder film, which would otherwise affect the connection, is not oxidized. Since the Ag filmmelts into the Sn solder simultaneously with melting of the Sn solder filmthe Ag filmdoes not hinder the connection.