The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
May. 10, 2007
Venkat Raghavan, Union City, CA (US);
Andrew Strachan, Santa Clara, CA (US);
Venkat Raghavan, Union City, CA (US);
Andrew Strachan, Santa Clara, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
In a method of forming MIM capacitor structure, a TiW layer is formed and a capacitor mask is used to define areas of the TiW layer that will be sued in the formation of the MIM capacitor. A capacitor mask is then used to expose surface areas of the TiW layer, followed by deposition of a capacitor dielectric layer. A via mask and etch are then performed to provide a contact via to the bottom plate TiW layer. After the via etch, a Ti/TiN liner stack is deposited. The Ti/TiN multilayer stacked film serves as the capacitor top plate as well as the via contact liner film. Next, Tungsten is deposited to fill the vias and a Tungsten planarization step is performed.