The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
May. 23, 2006
Lorenza Moro, San Carlos, CA (US);
Xi Chu, Freemont, CA (US);
Martin Philip Rosenblum, Menlo Park, CA (US);
Kenneth Jeffrey Nelson, Sunnyvale, CA (US);
Paul E. Burrows, Kennewick, WA (US);
Mark E. Gross, Pasco, WA (US);
Mac R. Zumhoff, Kennewick, WA (US);
Peter M. Martin, Kennewick, WA (US);
Charles C. Bonham, Richland, WA (US);
Gordon L. Graff, West Richland, WA (US);
Lorenza Moro, San Carlos, CA (US);
Xi Chu, Freemont, CA (US);
Martin Philip Rosenblum, Menlo Park, CA (US);
Kenneth Jeffrey Nelson, Sunnyvale, CA (US);
Paul E. Burrows, Kennewick, WA (US);
Mark E. Gross, Pasco, WA (US);
Mac R. Zumhoff, Kennewick, WA (US);
Peter M. Martin, Kennewick, WA (US);
Charles C. Bonham, Richland, WA (US);
Gordon L. Graff, West Richland, WA (US);
Vitex Systems, Inc., San Jose, CA (US);
Abstract
A method of making an encapsulated plasma sensitive device. The method comprises: providing a plasma sensitive device adjacent to a substrate; depositing a plasma protective layer on the plasma sensitive device using a process selected from non-plasma based processes, or modified sputtering processes; and depositing at least one barrier stack adjacent to the plasma protective layer, the at least one barrier stack comprising at least one decoupling layer and at least one barrier layer, the plasma sensitive device being encapsulated between the substrate and the at least one barrier stack, wherein the decoupling layer, the barrier layer, or both are deposited using a plasma process, the encapsulated plasma sensitive device having a reduced amount of damage caused by the plasma compared to an encapsulated plasma sensitive device made without the plasma protective layer. An encapsulated plasma sensitive device is also described.