The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
Jun. 07, 2006
Ben Kim, Wappingers Falls, NY (US);
Manoj Balachandran, Wappingers Falls, NY (US);
James Aloysius Hagan, Hopewell Junction, NY (US);
Deoram Persaud, Bronx, NY (US);
Adam Daniel Ticknor, Poughquag, NY (US);
Wei-tsu Tseng, Hopewell Junction, NY (US);
Ben Kim, Wappingers Falls, NY (US);
Manoj Balachandran, Wappingers Falls, NY (US);
James Aloysius Hagan, Hopewell Junction, NY (US);
Deoram Persaud, Bronx, NY (US);
Adam Daniel Ticknor, Poughquag, NY (US);
Wei-tsu Tseng, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The present invention is an apparatus and method for extending the life of abrasive disks used in the conditioning of polishing pads used in chemical mechanical planarization (CMP) of polishing pads used to polish and/or planarize the surfaces of semiconductor wafers during the production of integrated circuits. The invention consists of the a disk comprising a plurality of abrasive segments, each of which is fixed in tangential and radial relationship to one another about the common axis of rotation of the conditioning disk. Means are provided for movement of the abrasive segments, individually or in sets, into or out of the plane of the active abrasive surface of the conditioning disk according to the present invention.