The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7510323 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 31, 2009

Filed:

Mar. 14, 2006
Applicants:

Aquilur Rahman, Round Rock, TX (US);

Lloyd Andre Walls, Austin, TX (US);

Inventors:

Aquilur Rahman, Round Rock, TX (US);

Lloyd Andre Walls, Austin, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01K 7/16 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC. This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, a conductive element extending between first and second layers for connecting said first and second conductive paths into a single continuous conductive path having a resistance that varies with temperature. The sensor is responsive to electric current sent through said continuous path for determining temperature proximate to said continuous path from said path resistance.


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Rahman, Aquilur. (2009). Multi-layered thermal sensor for integrated circuits and other layered structures (U.S. Patent No. 7510323). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7510323

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