The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
May. 06, 2004
Mohinder Singh Bhatti, Amherst, NY (US);
Ilya Reyzin, Williamsville, NY (US);
Debashis Ghosh, Amherst, NY (US);
Shrikant Mukund Joshi, Williamsville, NY (US);
Mohinder Singh Bhatti, Amherst, NY (US);
Ilya Reyzin, Williamsville, NY (US);
Debashis Ghosh, Amherst, NY (US);
Shrikant Mukund Joshi, Williamsville, NY (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic device and a plurality of heat transfer fins project upwardly from the top surface and are coextensive with the heat dissipation area. Each of the heat transfer fins defines a plurality of steps having a rise and a run and each of the steps extend across the heat dissipation area for maximizing an amount of heat dissipated from the electronic device. The heat dissipation element is particularly useful in either one of a cold plate assembly used with a liquid cooled unit (LCU) or a boiler plate assembly used with a thermosiphon cooling unit (TCU).