The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
Jan. 09, 2006
Applicant:
Roy Knechtel, Geraberg, DE;
Inventor:
Roy Knechtel, Geraberg, DE;
Assignee:
X-Fab Semiconductor Foundries AG, Erfurt, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 3/08 (2006.01); G01B 5/30 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention relates to a method and arrangement for carrying out the nondestructive determination of the connection quality of bonded wafers () in order to verify the connection strength. The fact that an unbonded region () forms around a raised or recessed structure () on at least one of the connecting surfaces is made use of. The extension of the unbonded region is a measure of the strength of the wafer connection and is electrically determined by staggered contacts () that, with the formation of the bond connection, close, only in part, via a contact strip ().