The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2009
Filed:
Jan. 19, 2007
Koji Hyodo, Ibaraki, JP;
Chao-nan Xu, Saga, JP;
Takashi Yamane, Ibaraki, JP;
Motoyuki Akamatsu, Ibaraki, JP;
Yoshiyuki Yokogawa, Aichi, JP;
Tetsuya Kameyama, Aichi, JP;
Koji Hyodo, Ibaraki, JP;
Chao-Nan Xu, Saga, JP;
Takashi Yamane, Ibaraki, JP;
Motoyuki Akamatsu, Ibaraki, JP;
Yoshiyuki Yokogawa, Aichi, JP;
Tetsuya Kameyama, Aichi, JP;
Abstract
Provided are a stress analysis method and stress analysis equipment that enable a detailed stress measurement, by using both a photoelasticity measurement method and a stress measurement (mechanoluminescence measurement) which utilizes a mechanoluminescent substance to measure a stress state of an object. Physical quantities that are measurable include individual principal stress component and a principal stress direction. The photoelasticity measurement method alone cannot measure individual principal stress component values.