The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2009
Filed:
Dec. 09, 2004
Heimo Scheucher, Langegg, AT;
Heimo Scheucher, Langegg, AT;
NXP B.V., Eindhoven, NL;
Abstract
In a wafer () with a number of exposure fields (), each of which exposure fields () comprises a number of lattice fields () with an IC () located therein, two groups () of dicing paths () are provided and two control module fields (A, A, B, B, C, D, D, E, E, F) are assigned to each exposure field (), each of which control module fields extends parallel to a first direction (X) and contains at least one optical control module (OCM-A, OCM-A, OCM-BI, OCM-B, OCM-C, OCM-D, OCM-D, OCM-E, OCME, OCM-F), wherein a first control module field (OCM-A, OCM-B, OCM-C, OCMD, OCM-E, OCM-F) of each exposure field () is located between a first edge (R, S, T, U, V, Z) and a row of lattice fields () of the exposure field () in question and a second control module field (OCM-A, OCM-B, OCM-D, OCM-E) is located between two rows of lattice fields () of the exposure field () in question, which are arranged adjacent to a second edge (R, S, U, V), and wherein both the first control module fields (OCM-A, OCM-B, OCM-C, OCM-D, OCM-E, OCM-F) and the second control module fields (OCM-A, OCM-B, OCM-D, OCM-E) each lie in a first dicing path ().