The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2009
Filed:
Jul. 14, 2005
Takashi Kubota, Shiga, JP;
Takashi Kubota, Shiga, JP;
Sekisui Chemical Co., Ltd., Osaka, JP;
Abstract
It is an object of the present invention to provide a conductive fine particle having excellent conductivity, furthermore high adhesiveness with a core particle and little cohesion, a method for producing the conductive fine particle where the plating bath is highly stable and an anisotropic conductive material using the conductive fine particle. The present invention is a conductive fine particle, wherein an alloy plated coating film containing nickel, copper and phosphorous is formed on a surface of a core particle by an electroless plating method; preferably the conductive fine particle, wherein a content of phosphorous in the alloy plated coating film in a direction of a thickness is lower on a surface side of the alloy plated coating film than on a core particle side; a method for producing the conductive fine particle, wherein a first electroless plating reaction is carried out by adding a plating solution containing a nickel salt, a phosphorous reducing agent and a pH adjustor to an aqueous suspension of the core particles supporting a metal catalyst, and then, a second electroless plating reaction is carried out by adding a plating solution containing the nickel salt, a copper salt, the phosphorous based reducing agent and the pH adjustor.