The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2009

Filed:

Sep. 02, 2005
Applicant:

Syukiti Kawamura, Kurashiki, JP;

Inventor:

Syukiti Kawamura, Kurashiki, JP;

Assignee:

Kuraray Co., Ltd., Kurashiki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a multilayered pellet having a core-shell structure, wherein the core of the core-shell structure is made of an ethylene-vinyl alcohol copolymer resin composition (A), and the shell of the core-shell structure is made of an ethylene-vinyl alcohol copolymer resin composition (B). The ethylene-vinyl alcohol copolymer resin composition (A) constituting the multilayered pellet contains any one of (i) to (iii): (i) an ethylene-vinyl alcohol copolymer (a) and a modified ethylene-vinyl alcohol copolymer (b); (ii) a modified ethylene-vinyl alcohol copolymer (b); and (iii) an ethylene-vinyl alcohol copolymer (a) and a plasticizer (d). The modified ethylene-vinyl alcohol copolymer (b) is preferably a modified ethylene-vinyl alcohol copolymer having a predetermined unit or a modified ethylene-vinyl alcohol copolymer obtained by reacting the ethylene-vinyl alcohol copolymer (a) and a monovalent epoxy compound (c) having a molecular weight of not greater than 500. Difference of the heat sealing temperature (TA) of the ethylene-vinyl alcohol copolymer resin composition (A) and the heat sealing temperature (TB) of the ethylene-vinyl alcohol copolymer resin composition (B) is in the range of 3° C. to 100° C.


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