The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2009
Filed:
Oct. 01, 2007
Tetsuya Fukuda, Niigata-ken, JP;
Katsuya Kikuiri, Niigata-ken, JP;
Kiyoshi Sato, Niigata-ken, JP;
Mitsuru Watanabe, Niigata-ken, JP;
Yoshinobu Nakamura, Niigata-ken, JP;
Tetsuya Fukuda, Niigata-ken, JP;
Katsuya Kikuiri, Niigata-ken, JP;
Kiyoshi Sato, Niigata-ken, JP;
Mitsuru Watanabe, Niigata-ken, JP;
Yoshinobu Nakamura, Niigata-ken, JP;
Alps Electric Co., Ltd., Tokyo, JP;
Abstract
A package is mainly formed of a package body having a storage area for storing a pressure sensor, a capacity type pressure sensor stored in the storage area of the package body, a lid seals the package body in which the pressure sensor is stored, an adhesive agent for fixing the pressure sensor to the package body, and a bonding wire for electrically coupling a bonding pad of the pressure sensor and a conductive portion of the package body. An adhesive area of the package body and the pressure sensor is set to the area other than a projection area of the diaphragm of the pressure sensor on a mount bottom surface. This makes it possible to provide the package for the pressure sensor capable of detecting the pressure with high sensitivity although the gap between the substrate and the diaphragm has the value with the magnitude of several μms.