The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2009
Filed:
Nov. 14, 2000
Chia-yu Fu, Chandler, AZ (US);
Thomas A. Wetteroth, Chandler, AZ (US);
Rong-fong Huang, Tempe, AZ (US);
Chia-Yu Fu, Chandler, AZ (US);
Thomas A. Wetteroth, Chandler, AZ (US);
Rong-Fong Huang, Tempe, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A low profile integrated module is fabricated to include sheets of material, such as ceramic or PCB, fixed together and including a via extending through at least one of the plurality of sheets from the lower module surface partially to the upper module surface and in a side module surface. The via is filled with conductive material. The module is then mounted on a supporting substrate having a solder pad on the mounting surface with an area greater than the lower surface of the via. The lower surface of the via is positioned adjacent the upper surface of the mounting pad and soldered so that solder wicks up the via along the side module surface.