The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2009
Filed:
May. 13, 2005
Applicants:
Suk Hyeon Cho, Daejeon, KR;
Chang Sup Ryu, Daejeon, KR;
Jin Soo Jeong, Seoul, KR;
Jin Yong Ahn, Daejeon, KR;
Inventors:
Suk Hyeon Cho, Daejeon, KR;
Chang Sup Ryu, Daejeon, KR;
Jin Soo Jeong, Seoul, KR;
Jin Yong Ahn, Daejeon, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Kyunggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.