The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2009
Filed:
Jan. 24, 2007
Tomoo Iijima, Tokyo, JP;
Yoshitaka Fukuoka, Tokyo, JP;
Tomoo Iijima, Tokyo, JP;
Yoshitaka Fukuoka, Tokyo, JP;
Tessera Interconnect Materials, Inc., San Jose, CA (US);
Abstract
A multilayer wiring board includes a first insulating film and a first patterned metal wiring film extending along a first major surface thereof, and a second insulating film a second patterned metal wiring film extending along a second major surface thereof. The wiring board includes solid metal interconnects connecting the first patterned metal wiring film to the second patterned metal wiring film, the interconnects extending through at least one of the first and second insulating films, and a microelectronic element disposed between the first and second patterned wiring films, the microelectronic element having bond pads conductively connected to the first patterned metal wiring films. The wiring board also includes a plurality of external contacts exposed at one or more external surfaces of the multilayer wiring board, the contacts being conductively connected to at least one of the first and second patterned metal wiring films.