The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2009
Filed:
Oct. 06, 2005
Vacit Arat, La Canada Flintridge, CA (US);
Adam L. Cohen, Los Angeles, CA (US);
Dennis R. Smalley, Newhall, CA (US);
Ezekiel J. J. Kruglick, San Diego, CA (US);
Richard T. Chen, Burbank, CA (US);
Kieun Kim, Pasadena, CA (US);
Vacit Arat, La Canada Flintridge, CA (US);
Adam L. Cohen, Los Angeles, CA (US);
Dennis R. Smalley, Newhall, CA (US);
Ezekiel J. J. Kruglick, San Diego, CA (US);
Richard T. Chen, Burbank, CA (US);
Kieun Kim, Pasadena, CA (US);
Microfabrica Inc., Van Nuys, CA (US);
Abstract
Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.