The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2009
Filed:
Mar. 28, 2006
Applicants:
Sang-uk Kim, Chungcheongnam-do, KR;
Han-shin Youn, Chungcheongnam-do, KR;
Inventors:
Sang-Uk Kim, Chungcheongnam-do, KR;
Han-Shin Youn, Chungcheongnam-do, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor packaging mold includes first and second mold bodies, a cavity defined by the first and second mold bodies to provide a space for molding a semiconductor package, and a resin bleed preventing formation on a cavity surface of one of the first and second mold bodies to suppress resin bleeding.