The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2009
Filed:
Apr. 07, 2006
Applicants:
Joseph Andrew Martin, Hksar, CN;
King Yin Fred Fu, Hksar, CN;
Hoi Ping Patrick Phen, Hksar, CN;
Inventors:
Assignee:
QPL Limited, HKSAR, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic device comprises a leadframe attached to a die and embedded in a mold packaging with enhanced adhesion property. The leadframe comprises a bonding surface, a soldering surface, a mold adhesion surface, and a die attachment surface wherein the soldering surface and bonding surface are selectively plated with nickel/palladium/gold. The mold adhesion surface and the die attachment surface are roughened for better attachment to a mold and a die respectively.