The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2009
Filed:
Dec. 13, 2006
Applicants:
Orville W. Brown, Lansdale, PA (US);
Srinivasan Sridharan, Strongsville, OH (US);
Inventors:
Orville W. Brown, Lansdale, PA (US);
Srinivasan Sridharan, Strongsville, OH (US);
Assignee:
Ferro Corporation, Cleveland, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 8/18 (2006.01); C03C 8/22 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
Thick film conductive copper pastes that are lead-free and cadmium-free. The inventive copper pastes possess desirable characteristics, including good solderability, good wire bondability, a low firing temperature, and a wide temperature processing window, and provide excellent adhesion to a variety of substrates, including alumina and glass coated stainless steel substrates, as well as low resistivity, and a microstructure after firing that is dense and substantially free of pores.