The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2009
Filed:
Nov. 01, 2007
Dongweon Seo, Euiwang-shi, KR;
Juntae Hwang, Seoul, KR;
Dongweon Seo, Euiwang-shi, KR;
Juntae Hwang, Seoul, KR;
Phicom Corporation, Seoul, KR;
Other;
Abstract
The present invention relates to a method of manufacturing an interconnect device for a printed circuit board. According to one aspect of the present invention, a method of manufacturing an interconnect device comprises forming a protective film pattern on a sacrificial substrate for forming an interconnect device including a first contact section having a bar-like shape for making contact with a second contact terminal in a space transformer, a connecting section having an O-ring-like shape of which one side is opened and connected to one end of the first contact section in an integrated manner, a support section having an engaging protrusion in a predetermined portion and connected to one end of the connecting section in an integrated manner, and a second contact section having an O-ring-like shape and connected to one end of the support section in an integrated manner; filling a conductive material into the inside of the protective pattern, and removing the protective film pattern and the sacrificial substrate to finish the interconnect device.