The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2009
Filed:
Mar. 31, 2005
Anand Haridass, Austin, TX (US);
Dierk Kaller, Schoenaich, DE;
Erich Klink, Schoenaich, DE;
Gisbert Gerhard Thomke, Schoenaich, DE;
Anand Haridass, Austin, TX (US);
Dierk Kaller, Schoenaich, DE;
Erich Klink, Schoenaich, DE;
Gisbert Gerhard Thomke, Schoenaich, DE;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for increasing the wiring channels/density under dense via fields of a circuit board are provided. With the method, the power/ground lines for the circuit board are designed to be provided in an orthogonal or diagonal pattern. The land grid array (LGA)/ball grid array (BGA) makes contact only on the surface pads of the printed circuit board with no plated through holes/vias underneath these surface pads. This opens up wiring channels, which previously used to be occupied by plated through holes and anti-pads, that can now be used for maximizing signal line wiring routing.