Semiconductor laser assembly

Abstract

When a laser diode assembly is manufactured, bulb-shaped solder residue is not formed on a laser diode device, a submount, or a heatsink. A laser diode assembly () comprises a laser diode device (). A submount () is jointed on a substrate side of the laser diode device () with a first solder layer () in between. A heatsink () is jointed on a rear face side of the submount () with a second solder layer () in between. The submount () is provided with a submount groove () formed along border of a joint area jointed with the laser diode device () and an extension groove () extending to edges of the submount (). Several submount thin grooves () whose width is smaller and depth is shallower than of the submount groove () are formed in the joint area of the submount in the shape of lattice and in the direction diagonally to the submount groove () so that the submount thin grooves () are spaced from each other and at least one ends of the submount thin grooves () contact with the submount groove (). When solder joint of the laser diode device () is performed, excessive solder flows into the submount groove () through the submount thin grooves (). The submount groove () functions as a solder pool for the excessive solder, and the excessive solder is drained outside through the extension groove ().