The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2009
Filed:
Dec. 05, 2007
Yi-sung Hwang, Chungcheongnam-do, KR;
Ho-tae Jin, Chungcheongnam-do, KR;
Hwan-young Jang, Chungcheongnam-do, KR;
Yi-Sung Hwang, Chungcheongnam-do, KR;
Ho-Tae Jin, Chungcheongnam-do, KR;
Hwan-Young Jang, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
Provided is a thin printed circuit board (PCB) for manufacturing a chip scale package (CSP). The thin printed circuit board includes a plurality of unit printed circuit boards, each of which is comprised of a circuit pattern, to which a semiconductor chip is adhered, and a substrate surrounding the circuit pattern. The unit printed boards are arranged in a row and includes a support molding, which is spaced a predetermined interval apart from the circuit pattern of each unit printed circuit board on the substrate of each unit printed circuit board and formed in a ring shape along the edge of the thin printed circuit board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile