The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2009

Filed:

Mar. 07, 2005
Applicants:

Yoshiaki Morishita, Kanagawa, JP;

Nobuteru OH, Kanagawa, JP;

Inventors:

Yoshiaki Morishita, Kanagawa, JP;

Nobuteru Oh, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

The semiconductor apparatus includes an upper semiconductor chip having an upper external terminal and a lower semiconductor chip having a lower bump for electrically connecting a lower external terminal and the upper external terminal. The circuit surfaces of the upper semiconductor chip and the lower semiconductor chip are electrically connected to each other via the bump. A low impedance line having lower impedance than the internal line of the lower semiconductor chip is formed on top of the lower semiconductor chip for electrically connecting the lower external terminal and the bump.


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