The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2009
Filed:
Oct. 26, 2004
Eiichi Hosomi, Austin, TX (US);
Eiichi Hosomi, Austin, TX (US);
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
Systems and methods for a structure for a power distribution network intended to distribute power from a PCB to a semiconductor device on a package. These improved power distribution networks may reduce current crowding in the BGA balls of a package and may serve to more equitably distribute current through the BGA balls of the package through increasing the impedance of the package or decreasing the impedance of the PCB to which the package is coupled. These systems and methods may increase the impedance of the package through various arrangements of the coupling between BGA balls and planes of the package. By the same token, these systems and methods may decrease the impedance of the PCB coupled to the package by arrangement of the coupling between the PCB and the BGA balls of the package.