The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2009
Filed:
Aug. 01, 2005
Woo-suk Choi, Yongin-si, KR;
Joong-do Kim, Yongin-si, KR;
Eun-hee Kim, Yongin-si, KR;
Soo-bong Lee, Yongin-si, KR;
Woo-suk Choi, Yongin-si, KR;
Joong-do Kim, Yongin-si, KR;
Eun-hee Kim, Yongin-si, KR;
Soo-bong Lee, Yongin-si, KR;
Samsung Techwin Co., Ltd., Changwon, KR;
Abstract
Provided are a semiconductor lead frame, a semiconductor package having the semiconductor lead frame, and a method of plating the semiconductor lead frame. The method includes preparing a substrate formed of a Fe—Ni alloy (alloy 42), and a plating layer that contains grains less than 1 micrometer in size and is plated on the substrate. The growth of whiskers when a Sn plated layer is formed on a substrate formed of a Fe—Ni alloy (alloy 42) can be suppressed by minimizing the grain size of the Sn plated layer.