The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2009

Filed:

May. 05, 2005
Applicant:

Brian Von Herzen, Carson City, NV (US);

Inventor:

Brian Von Herzen, Carson City, NV (US);

Assignee:

Xilinx, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

An interconnect array formed at least in part using repeated application of an interconnect pattern is described. The interconnect pattern has at least ten interconnect locations. One of the ten interconnect locations is for a power interconnect. Another one of the ten interconnect locations is for a ground interconnect. At least eight interconnect locations remaining are for additional interconnects. The at least eight remaining interconnect locations disposed around a medial region, where either the ground interconnect or the power interconnect is located in the medial region. An offset region having the one of either the ground interconnect or the power interconnect not in the medial region. The interconnect array is at least partially formed by repeated application of the interconnect pattern off-set from one another responsive to the offset region.


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