The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2009
Filed:
Jul. 29, 2004
Tomohiko Matsushita, Kadoma, JP;
Shigeru Aoyama, Kyoto, JP;
Takeo Nishikawa, Ibaraki, JP;
Yuko Tsuda, Tokyo, JP;
Shigemi Norioka, Ibaraki, JP;
Tetsuichi Wazawa, Suita, JP;
Tomohiko Matsushita, Kadoma, JP;
Shigeru Aoyama, Kyoto, JP;
Takeo Nishikawa, Ibaraki, JP;
Yuko Tsuda, Tokyo, JP;
Shigemi Norioka, Ibaraki, JP;
Tetsuichi Wazawa, Suita, JP;
OMRON Corporation, Kyoto, JP;
Abstract
A method of mass-producing minute structures such as biochips, protein chips, quantum dots, and quantum chips involves arranging an antigen two-dimensionally on a board and arranging probes two-dimensionally facing the same direction so that the binding sites of the probes may bind to the antigen. An inorganic substance such as Ni is deposited on the board from the upper side of the probes by sputtering or evaporation to form a thin film layer and on the top surface of the flatly formed thin film layer, a supporting layer is formed by separating out the same inorganic substance using electrotyping. Then, by peeling the thin film layer and the supporting layer off of the board together, the mother stamper having cavities for the patterns of biomolecules is obtained.