The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2009

Filed:

Feb. 02, 2004
Applicants:

Hai BO Wen, Warsaw, IN (US);

Panjian LI, Fort Wayne, IN (US);

Todd Smith, Fort Wayne, IN (US);

Inventors:

Hai Bo Wen, Warsaw, IN (US);

Panjian Li, Fort Wayne, IN (US);

Todd Smith, Fort Wayne, IN (US);

Assignee:

DePuy Products, Inc., Warsaw, IN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C23F 1/00 (2006.01); C25F 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides a method of providing a metallic orthopaedic implant with a micron or nanometer-scale surface roughness to facilitate acceptance of tissue and bone growth or apposition after implantation while maintaining the structural integrity of the orthopaedic implant. The invention also provides a metallic orthopaedic implant comprising a metallic body and metallic elements adhered to a portion of the surface of the metallic body to define a three-dimensional porous surface geometry, wherein at least some of the metallic elements have a micron or nanometer-scale surface roughness.


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