The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2009
Filed:
Jun. 17, 2005
Applicants:
L. James Lee, Columbus, OH (US);
David Lane Tomasko, Columbus, OH (US);
Yong Yang, Columbus, OH (US);
Changchun Zeng, Salt Lake City, UT (US);
Inventors:
L. James Lee, Columbus, OH (US);
David Lane Tomasko, Columbus, OH (US);
Yong Yang, Columbus, OH (US);
Changchun Zeng, Salt Lake City, UT (US);
Assignee:
The Ohio State University, Columbus, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 5/02 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of bonding materials. The method comprises providing a polymer; providing a second material; contacting the polymer and the second material at a low contact pressure in the absence of a solvent or an adhesive; maintaining the polymer at a temperature less than a bulk Tg of the polymer; introducing a gas at low pressure; and bonding the polymer and the second material.