The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2009
Filed:
Jul. 22, 2005
Hironori Takahashi, Nagoya, JP;
Hirofumi Hosokawa, Nagoya, JP;
Yoshimasa Kondo, Nagoya, JP;
Masayuki Hironaga, Tokai, JP;
Hironori Takahashi, Nagoya, JP;
Hirofumi Hosokawa, Nagoya, JP;
Yoshimasa Kondo, Nagoya, JP;
Masayuki Hironaga, Tokai, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
A die for forming a honeycomb structure may realize a sophisticated formability and superior resistance to wear. The die may be provided with a die base including two surfaces, one being provided with slits of honeycomb shape, and the other being provided with back holes through which a forming material may be introduced. The die base may include: a die precursor obtained by stacking and bonding a first member (one surface of the die base) and of tungsten carbide-based super hard alloy and a second member (the other surface of the die base) and of a metal material that causes at least up to three phase transformation of martensite transformation, bainite transformation, and pearlite transformation by cooling of an austenite phase together. Tensile and compressive stresses in a mutually bonded surface of the two plate-like members are 1000 MPa or less.