The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2009
Filed:
Jan. 16, 2003
Mitsuo Suehiro, Kawasaki, JP;
Mitsuo Suehiro, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A printed circuit board unit includes an insulated film disposed between a printed circuit board and an electronic component so as to define a through hole. The through hole may be designed to form a constriction in a solder bump. The solder bump is received on an input/output pad located on the printed circuit board. When the electronic component is detached from the printed circuit board, the insulated film is slid along the surface of the printed circuit board while the solder bump is kept at a melting temperature. The sliding movement of the insulated film serves to completely wipe out the melted solder bump from the input/output pad. When the electronic component is thereafter lifted up, the electronic component holding the solder bump can be detached from the printed circuit board. The solder hardly remains on the input/output pad.