The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2009
Filed:
Jun. 21, 2006
Kozo Tanaka, Tokyo, JP;
Shinichi Seki, Tokyo, JP;
Kozo Tanaka, Tokyo, JP;
Shinichi Seki, Tokyo, JP;
Stanley Electric Co., Ltd., Tokyo, JP;
Abstract
In accordance with one example of the disclosed subject matter, a semiconductor device can include the following features. A first lead frame can be provided that has one end configured to form a recess. An LED chip can be mounted on an inner bottom surface of the recess. A bonding wire has one end connected to an electrode on the LED chip. A second lead frame has one end connected to the other end of the bonding wire. The LED chip and the bonding wire can be sealed in a sealing resin. The first lead frame and the second lead frame can protrude from the sealing resin and can be bent around to the bottom of the sealing resin. A groove formed through the center of the bottom of the sealing resin at least partly exposes an outer circumferential surface and an outer bottom surface of the recess from the sealing resin and into the groove.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile