The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2009

Filed:

Dec. 28, 2006
Applicants:

Takaya Otsuki, Kyoto, JP;

Naoto Yamaoka, Kyoto, JP;

Inventors:

Takaya Otsuki, Kyoto, JP;

Naoto Yamaoka, Kyoto, JP;

Assignee:

Nidec Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 7/00 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipating device which dissipates heat generated by a heat generating object mounted on a base includes a heat sink body, a heat-conducting area, a tip portion, an inclined surface, and a fastener. The heat-conducting area includes the tip portion, which is a substantially middle portion of the heat-conducting area and is arranged substantially closest to the heat generating object among the other areas of the heat-conducting area, and the inclined surface which is a part of the heat-conducting area and inclines outwardly from the tip portion such that a distance between the inclined surface and the heat generating object gradually increases. The fastener includes an attaching portion to mount the heat dissipating device to the base, and the attaching portion is arranged substantially radially outside of an outer peripheral portion of the heat generating object. When the attaching portion is secured to the base, the tip portion of the heat-conducting area is pressed to the heat generating object.


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